The DISCO DFD6240 is a fully automatic, single-spindle precision dicing saw that utilizes a mechanical dicing blade rather than a laser. Positioned as one of the world’s most compact fully automatic, single-spindle dicing saws, it offers a footprint comparable to that of a manual machine while retaining full automation capabilities.
Core Positioning and Features
The primary design objective is to provide fully automatic dicing capabilities within a limited space. By optimizing the frame structure and the layout of the workpiece handling units, the footprint has been reduced by approximately 20% compared to its predecessor, the DFD641—making it similar in size to DISCO’s own semi-automatic model, the DAD3350. Furthermore, the machine features reduced power and compressed air consumption, helping to lower operating costs.
Key Specifications and Configuration
Processing Capacity: Supports workpieces up to Φ200 mm (8 inches). The X and Y axes both offer a cutting/travel range of 210 mm. The X-axis cutting speed ranges from 0.1 to 1,000 mm/s, while the Y-axis positioning accuracy is nominally 0.002 mm/210 mm (with a single-point error of 0.002 mm/5 mm).
Spindle Options: The standard configuration includes a 1.2 kW high-rigidity spindle. Optional 1.8 kW (for 2-inch blades) or 2.2 kW (for 3-inch blades) spindles are available to handle high-load materials such as glass and ceramics.
Quality and Operation: The machine incorporates the newly developed "Synchro Spindle™" to enhance radial rigidity, ensuring consistent cutting quality. For blade changes, the system features an automatic blade-cover opening/closing mechanism and a spindle-locking function, allowing operators to perform replacements from the front of the machine.
Applicable Materials
In addition to standard semiconductor materials like silicon, the availability of high-power spindle options makes the DFD6240 suitable for processing electronic and optical materials that impose higher loads, such as ceramics and glass.
