The DISCO DFD681 is a fully automatic, single-spindle precision dicing saw that utilizes a mechanical dicing blade. It is primarily designed for processing difficult-to-cut materials, such as glass, ceramics, quartz, and lithium niobate.
Core Specifications
The machine is equipped with a 2.2 kW Synchro Spindle™ with a rated speed of 30,000 rpm and supports the use of dicing blades up to φ76.2 mm (3 inches) in diameter. Both the X and Y axes offer a cutting range of 210 mm; the Y-axis positioning accuracy is rated at 0.003 mm/210 mm (with a single-step error of 0.002 mm/5 mm), while the Z-axis repeatability is 0.001 mm. The equipment weighs approximately 1,300 kg.
Process Capabilities
The primary value of the DFD681 lies in its ability to process high-hardness or brittle materials. Compared to standard dicing saws designed for silicon wafers, its 2.2 kW spindle and compatibility with 3-inch blades provide superior cutting rigidity, making it well-suited for materials such as quartz, glass, ceramics, lithium niobate (LiNbO₃), and lithium tantalate (LiTaO₃). The system features automatic alignment and fully automated wafer handling, with support for 6-inch or 8-inch wafer cassettes.
