ASM AB550 Fully Automatic Wire Bonder for sale

The ASM AB550 is a fully automatic wire bonder designed for ultrasonic bonding with fine aluminum wire. It is commonly used in high-density substrate packaging applications, such as COB (Chip-on-Board), RFID, and narrow-strip PCB assemblies. The system is specifically tailored for production lines that have already adopted an aluminum wire process; it is not intended for applications requiring gold or copper wire bonding.

In terms of performance, the AB550 offers a nominal bonding speed of up to 9 wires per second. It supports fine-pitch applications, accommodating bond pads as small as 63 μm × 80 μm with a pitch of 68 μm. The effective bonding area has a diameter of 100 mm—approximately 1.75 times larger than that of its predecessor, the AB530. The machine features a patented "PR On The Fly" (pattern recognition) function, which, according to the manufacturer, can reduce pattern recognition time by up to 48%; this feature is specifically optimized for RFID and narrow-strip PCB panels. The worktable design allows for a loading/unloading time of approximately 4 seconds per cycle, and its increased capacity helps reduce the frequency of material replenishment.