Used ASM AB383 for sale

The ASM AB383 is a high-speed, fully automatic wire bonder designed specifically for LED packaging, boasting a significant installed base in the field of LED ball bonding. It is purpose-built to optimize wire bonding for SMD-type LED products, including 5050, 5630, 3528, side-view LEDs, and ChipLEDs.

In terms of hardware and process, the AB383 features an updated hardware architecture designed to simplify maintenance. It offers high-resolution bonding head performance, with some specifications citing an accuracy level of 40nm. The system is equipped with a fully automatic image recognition suite and lenses tailored for LED chips, enhancing both recognition and alignment efficiency. Regarding wire compatibility, the machine comes configured for gold wire bonding and can be upgraded to support copper, alloy (copper-palladium), or silver wire, accommodating various cost structures and process requirements. Furthermore, its EFO (Electronic Flame-Off) unit utilizes a segmented spark-formation technique, which improves the control of the Free Air Ball (FAB) shape when using materials other than gold.