Used ASM AB589 Series wire bonder for sale

The ASM AB589 series is a fully automatic fine aluminum wire wedge bonder featuring a rotary bonding head design. It is primarily targeted at advanced packaging and Chip-on-Board (COB) production lines that demand high levels of precision and efficiency.

Core Positioning and Process Type

Within the ASM product portfolio, this series is explicitly categorized for aluminum wire wedge bonding. Listings on secondary-market equipment platforms describe it as a "Rotary Head Fine Aluminum Wire Bonding System," and records from the equipment platform at Zhejiang University specify an aluminum wire diameter range of 17.8–50.8 μm, confirming its focus on fine aluminum wire processes. It is not a gold-wire ball bonder; therefore, the AB589 is not suitable for production lines that primarily require gold or copper wire ball bonding.

Key Performance Indicators

Official specifications include a bonding speed of 6.5 wires per second and a fine-pitch capability of 55 μm × 65 μm. The standard effective bonding area is 8" × 6" (with an optional 14" × 6" configuration). The system also incorporates a patented "PR On The Fly" (pattern recognition) feature, which reduces alignment time. Regarding bonding precision, data from the Zhejiang University platform indicates an accuracy of ± 10.2 μm.

Applications and Options

This series supports the processing of connected (panelized) substrates, allowing for vertical integration of the production material flow and mitigating issues associated with singulation (dicing) processes. Available options include fully automatic material handling (AB589-H), deep-cavity bonding capabilities, a 45° wire-feed bonding head, and support for gold wire. This means that while the system is primarily designed for aluminum wire wedge bonding, specific configurations allow for expansion to other wire types or applications involving deep cavities.