Used ASM Cheetah II wire bonder for sale

The ASM Cheetah II, a wire bonder frequently encountered on the secondary market, requires careful identification: it is not a standardized model with a fixed configuration, but rather a flexible platform that can be tailored to specific bonding processes. Public documentation sometimes refers to it as a "wire bonder" and at other times as a "die bonder" (or "chip bonder"). This is because the platform supports a variety of bonding technologies—including thermosonic gold ball bonding, thermosonic copper wedge bonding, and ultrasonic aluminum wire bonding—with its specific capabilities determined by the bonding head, transducer, and wire-feeding system installed on any given unit.

In terms of performance specifications, the platform offers a nominal placement accuracy of approximately ±2.5 μm, a vision system resolution of about 0.5 pixels, and, under certain configurations, a bonding cycle time in the 40 ms range. It should be noted that these figures represent the upper limits of the platform’s performance under specific configurations and test conditions; actual performance depends heavily on the condition of the bonding head, the remaining lifespan of the sensors, and the software version installed on the individual machine.