K&S IConn Plus

The K&S IConn Plus is a mature, fully automatic thermosonic wire bonder from Kulicke & Soffa, designed for the mid-to-high-end semiconductor packaging market. It offers a core precision of ±2.0 μm (at 3σ), supports ultra-fine pitches down to 35 μm, and enables a minimum wire loop height of 40 μm (using 0.6 mil wire). The system is equipped with a dual-frequency transducer and a WAVI (Wide-Angle Vertical Illumination) system, complemented by 1pF Auto-BITS post-bond inspection to ensure process stability. With a standard bonding area of 56 mm (X) × 80 mm (Y) and compatibility with gold, copper, and silver wires, it is well-suited for high-volume production applications, including LED, memory, and general IC packaging.