ACCRETECH TSK FP2000

The ACCRETECH TSK FP2000 is a high-precision, fully automated prober designed for 200mm wafer-on-frame applications. It is specifically engineered for testing CSP/WLCSP and MEMS devices that have been mounted on frames following the dicing process. Its core advantage lies in a unique calibration technology that compensates for positioning errors caused by frame deformation or die displacement, ensuring precise contact between the probe and tiny bond pads. The system offers exceptional flexibility, allowing for one-touch switching between frame-based handling and the testing of full wafers (ranging from 5 to 8 inches) without the need for hardware changes. Optional features—such as high-temperature testing environments, probe-mark inspection, and FFU (Fan Filter Unit) cleanroom modules—make it an ideal solution for back-end die sorting, failure analysis, and small-to-medium-volume package testing.