Bonder Afã horow no
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Wafer Ring Unit Dade P / N: 102269361
Wafer ring device a ɛwɔ Besi die bonder no mu no ne core execution component a ɛwɔ wafer supply system no muKenkan pii -
Dade Z-DRIVE PPBAZ P/N: 5000-0210
Ɛyɛ core drive component a ɛwɔ bonding head a ɛwɔ Besi die bonder mu, a ɛyɛ nea ɛyɛ pɛpɛɛpɛ vertical positioning ne force control.Kenkan pii











