Ebitundu bya Bonder

Wafer Ring Unit Ekyuma P/N:102269361
2026-10-22
Ekyuma ekikola empeta ya wafer ekya Besi die bonder kye kitundu ekikulu eky’okukola mu nkola y’okugabira wafer
Soma wano ebisingawo
Ekyuma Z-DRIVE PPBAZ P/N: 5000-0210
2026-10-22
Ye kitundu kya core drive munda mu mutwe gw’okusiba (bonding head) gwa Besi die bonder, evunaanyizibwa ku kuteeka mu kifo ekituufu mu nneekulungirivu n’okufuga amaanyi.
Soma wano ebisingawo

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