Die Bonder Parts

Besi Wafer Ring Unit P/N:102269361
2026-10-22
The wafer ring device of the Besi die bonder is the core execution component of the wafer supply system
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Besi Z-DRIVE PPBAZ P/N: 5000-0210
2026-10-22
It is the core drive component within the bonding head of a Besi die bonder, responsible for precise vertical positioning and force control.
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