ASM AD211

The ASM AD211 is an automatic die bonder—a piece of equipment used in the semiconductor packaging process by ASM (now ASMPT). It is primarily designed for the high-precision placement of small-to-medium-sized dies onto lead frames or substrates, making it well-suited for the high-volume production of electronic components.

The system features a high-precision vision system, closed-loop motion control, and vibration control capabilities. It supports sub-micron placement accuracy (with some documentation specifying sub-3-micron precision) while maintaining an exceptionally low defect rate. Its variants, the AD211 Plus and Plus-II, offer enhanced eutectic bonding capabilities. These models are widely used in sectors such as LED manufacturing (particularly for automotive and outdoor lighting) and LiDAR; certain configurations can achieve an alignment accuracy of approximately 7 microns with a cycle time of 540 milliseconds.