ASM AD50iPro

The ASM AD50iPro is a high-speed, fully automated die bonder. Positioned within ASM's die bonder product line as a mass-production model balancing capacity and precision, it is commonly used in semiconductor packaging processes such as TO packaging.

Core Performance and Specifications

The core advantage of this model lies in its balance between high speed and precision. Its die bond cycle time can be as low as 50 ms, XY positioning accuracy reaches ±25 µm @ 3σ, and chip angle accuracy is controlled within ±3°. In terms of material compatibility, it supports processing microchips as small as 3 mil while accommodating substrates as large as 270 × 100 mm, covering a wide range of processes.

Quality Control and Maintenance

The equipment integrates comprehensive quality inspection functions, including post-soldering inspection and real-time die bond performance monitoring, and can automatically collect die bond data for easy production management and traceability. Mechanically, it uses a linear motor drive; official data states that this design helps significantly reduce long-term maintenance costs while also being energy-efficient. The dimensions of the fuselage are 1570 × 1160 × 2057 mm³.