ASM AD830 Plus-R

The ASM AD830 Plus-R is a fully automated epoxy die bonder from ASMPT's AD830 Plus series, specifically designed for 6-inch wafer processing. Its core focus is high-speed mass production, making it particularly suitable for high-density leadframe packaging in fields such as LEDs and sensors.

Key Features: The most significant differentiating feature of this model is its tape-and-reel material handling capability (AD830Plus-R model only), while also supporting optional 8-inch wafer processing capabilities. In terms of speed and accuracy, the AD830 Plus series can achieve throughput of up to 22,000 UPH, with an alignment accuracy of approximately ±25.4 µm, and is compatible with chip sizes ranging from 0.15 mm to 5.08 mm.

Technical Configuration: The equipment employs a patented bonding head design and a dual decoupled linear motor system, combined with a rotating bonding arm, to automatically correct chip angles during pick-up and placement. An arrayed optical system and a white LED full-color camera further enhance adaptability to different substrates and die bonding speed, and support simultaneous pre- and post-bonding inspection. The dimensions of the fuselage are 1,740 × 1,240 × 2,080 mm³.