BESI Esec 2100 hS iXplus

The BESI Esec 2100 hS iXplus is the latest high-speed die bonder in the 2100 i family, designed to deliver industry-leading speed for single-point dispensing applications while offering robust long-term scalability. A key innovation is its continuous epoxy pattern-writing technology, which significantly boosts dispensing speed and ensures process stability. When combined with an optimized vision strategy capable of keeping pace with any pick-and-place speed, the system achieves a theoretical throughput of up to 20,000 UPH.

In terms of precision, the system offers 18 μm @3σ in standard mode and 20 μm @3σ in high-speed mode, with a dedicated precision mode that can reach 12 μm. It supports wafers ranging from 4 to 12 inches and die sizes from 0.5 to 20 mm, while remaining compatible with mainstream packages such as QFN, BGA, and SiP. This fifth-generation platform integrates a 4-megapixel vision system with AI-assisted inspection. Furthermore, it supports long-term investment protection through optional upgrades, including upward-looking vision systems and high-precision bond heads.