BESI Esec 2100 SC

The BESI Esec DB 2100SC is a highly flexible, high-speed 300mm die-bonding platform designed for smart card tape applications—a system that has earned the Swiss Technology Award. Its core advantage lies in achieving maximum throughput while maintaining 25μm precision; this is made possible by the symmetric design of the Phi-Y pick-and-place system, which minimizes settling time and suppresses vibration, thereby boosting units-per-hour (UPH) performance.

The equipment utilizes a single-collet transport system that enables 100% post-bond inspection at high speeds. Critical alignment is handled by a camera system, significantly reducing the need for mechanical adjustments. An optional three-zone heating system is available for pre-curing and void control. For operational ease, the platform offers real-time process monitoring and integrated online help; it also supports tool-less product changeovers and the transfer of process recipes between machines, drastically reducing downtime during product transitions. A 50N bonding force comes as standard, and a third process station is pre-configured to accommodate future expansion into advanced applications, effectively safeguarding your equipment investment.