ASM AD8312FC

The AD8312FC is a model in the ASMPT AD8312 series specializing in flip-chip bonding and direct die bonding, positioned to provide a fully automated high-speed packaging solution for low-lead-count flip-chip devices (such as SOIC, SO, QFN, BGA, LGA, etc.).

Core Positioning: Two-in-One Process

The biggest feature of this model is that it integrates flip-chip bonding and direct die bonding on the same platform, allowing for easy switching between the two process modes and facilitating flexible product type switching on production lines. It is developed based on the AD8312 series platform, with the AD8312Plus model in the same series focusing on silver paste die bonding.

Key Technologies and Capabilities

The equipment is equipped with a patented high-speed soldering head system (dual decoupled soldering heads) to achieve leading die bonding speeds. In terms of accuracy, the official specifications emphasize its "superior soldering accuracy," suitable for the fine placement requirements of low-lead-count devices. For inspection capabilities, it supports comprehensive inspection at multiple locations, contributing to process quality control. Furthermore, the machine has high-density lead frame handling capabilities, adapting to high-volume packaging lines. The dimensions of the fuselage are 2,380 × 1,430 × 1,935 mm.