ASM SD8312

The ASM SD8312 is indeed a die bonder, but more accurately, it's a fully automated soft solder die bonder system designed by ASMPT specifically for the power semiconductor market. It's primarily used for packaging power devices such as SOT223, TO-92, TO-220, and DPAK matrices.

Core Positioning and Process: Its core process is soft solder die bonding, rather than conventional silver paste die bonding. The equipment supports 12-inch wafer processing and employs a universal stage design, capable of handling the packaging requirements of high-density leadframes, ensuring speed while also meeting the process stability requirements of next-generation power devices.

Key Features: Addressing the environmental sensitivity of soft solder bonding, the SD8312 has the ability to precisely control the oxygen level during die bonding to ensure solder quality. Furthermore, this model supports AB chip processing capabilities, further expanding its applicability in complex power packaging scenarios. The machine dimensions are approximately 1,950 × 1,600 × 1,400 mm.