ASM AB383

The AB383 from ASM is a fully automatic wire bonder, specifically designed as a high-speed wire bonding machine for LED applications—distinct from a die bonder. It is primarily targeted at SMD LED packaging, supporting products such as 5050, 5630, and 3528 LEDs, side-view LEDs, and ChipLEDs, while also offering programming capabilities for Chip-on-Board (COB) applications.

In terms of core performance, the bonding head features a resolution of up to 40nm, with a wire-bonding cycle time of approximately 45ms, striking an effective balance between precision and throughput. The system offers excellent wire compatibility; it comes pre-configured for gold wire, with optional upgrades available for copper, copper-palladium alloy, and silver wires. This model is widely deployed across the domestic LED packaging industry for planar ball bonding, representing a mature, production-proven solution.