ASM VORTEX II

The ASM VORTEX II is a high-performance LED die bonder from ASMPT specifically designed for Mini LED direct-view displays. Its core focus is addressing the high-precision, high-reliability mounting requirements of ultra-fine pitch RGB displays for extremely small chips, particularly for applications with zero tolerance for quality, such as automotive displays.

Core Performance and Precision: This machine can handle Mini LED chips as small as 2 mil × 4 mil (50 µm × 100 µm). It features a newly developed bonding head with zero-delay automatic XYθ correction capability, achieving XY mounting accuracy of ±10 µm @ 3σ and chip rotation accuracy of ±1° @ 3σ. Combined with patented bonding head technology, it maintains process stability even at maximum capacity, achieving a 99.999% yield rate.

Automation and Production Line Integration: The equipment supports fully automated RGB wafer processing, enabling one-stop production and efficient chip mixing to ensure uniform screen color. At the same time, it connects to the Industry 4.0 architecture through ASMPT's In-Line Linker system, making it easy to integrate into automated manufacturing processes.