ACCRETECH TSK UF3000

The ACCRETECH TSK UF3000 is a fully automatic wafer prober designed for 300mm (12-inch) wafers. It serves as the de facto industry standard for semiconductor testing, capable of handling both high-mix, low-volume production for system LSIs and high-volume mass production for memory devices.

Its core strength lies in the balance between high precision and high throughput. It utilizes a newly developed, dedicated XY drive system that enables high-speed, low-vibration movement. Combined with a highly rigid chassis and an automated probe mark inspection (PMI) function, the system ensures reliable contact between the probe and the pad. The equipment supports testing at temperatures ranging from ambient to 150°C, with chuck flatness maintained within 15–30μm across the entire temperature range; it also supports the handling of thin wafers. In terms of expandability, the system offers options such as low-temperature testing (down to -55°C in certain configurations), automatic probe card changing, OCR-based wafer identification, and integrated clean units. It is well-suited for a wide range of applications, including WAT/CP testing, RF/mmW testing, high-voltage/high-current testing, and the testing of optoelectronic devices. Thanks to its mature platform design and low cost of ownership (CoO), the UF3000 remains highly sought after in the secondary market and continues to be a practical, reliable choice for 300mm wafer testing production lines.