Used SINTAIKE STK-6150

The SINTAIKE STK-6150 is a floor-standing, semi-automatic wafer taping machine designed to apply protective tape to the patterned side of a wafer prior to back-grinding or dicing.

As an upgraded model in the STK-6100 series, it features enhancements in both hardware architecture and process control:

Automation and Efficiency: The system utilizes a manual wafer loading/unloading process combined with automatic tape application and cutting. Compared to tabletop units, the floor-standing design offers greater operational stability, making it well-suited for higher-throughput production environments.

Temperature Control and Lamination Capability: Equipped with heating modules for the stage and the cutting blade (the stage can reach temperatures exceeding 100°C) and featuring anti-static rollers, the machine significantly improves lamination quality—even for warped wafers—while minimizing the occurrence of air bubbles and tape delamination.

Anti-Static System: It incorporates a comprehensive three-tier anti-static design—utilizing a Teflon-coated stage, anti-static rollers, and an ionizer—and is compatible with various tape types, including blue tape and UV-curable tape. It supports the processing of wafers ranging from 4 to 8 inches in diameter.

Summary: This machine serves as a cost-effective solution for small-to-medium-scale production lines or R&D environments, offering superior stability and lamination quality compared to tabletop models (such as the 6020 series).