HYBOND 616B-005 Thermo-ultrasonic Single-Channel Peg Bonder

The HYBOND 616B-005 is a thermosonic single-channel "peg bonder" designed for interconnect applications that do not require wire feeding. Unlike the wedge-bonding or ball-bonding configurations of the 676 and 626 models you previously inquired about, this unit utilizes a specialized "peg bonding" technical approach.

Core Positioning: This equipment is designed for the thermosonic attachment of insulated wires, bare wires, or ribbons. Typical applications include Hard Disk Drive Head Stack/Gimbal Assemblies (HSA/HGA), microwave and sensor circuitry, flex-on-flex interconnects, ribbon tacking, pin/tab bonding, and mesh bonding. With the optional OP-47 package, it can be configured as a Beam Lead Diode (BLD) bonder, enabling an integrated pick-place-and-bond process that eliminates the need for pre-alignment.

Technical Specifications: The system features HYBOND’s proprietary Soft-Touch™ bonding force mechanism; upon contact with the bonding surface, a sensor triggers the cessation of Z-axis motion, thereby minimizing impact damage to sensitive components. It offers a 0.75-inch vertical bonding window, with a search height adjustable in 0.001-inch increments. The ultrasonic system utilizes a 62.5 kHz PLL self-tuning circuit, with power settings of 0–2W (low range) and 0–4W (high range). Bonding parameters include a duration of 0–900ms and a force range of 12–300g, with an integrated temperature control range of 15–250°C. It supports wire diameters from 0.7 to 3.0 mil (18–76 μm) and ribbons up to 1×20 mil. In short, the 616B-005 is a specialized thermosonic pin-bonding platform from HYBOND, designed for interconnecting hard disk drive components and microcircuits; within the product lineup, it complements the 676 (for deep-cavity wedge bonding) and the 626 (a multifunctional R&D system) by addressing specific application requirements.