K&S 4522 manual/semi-automatic gold ball bonder

The K&S 4522 is a manual/semi-automatic gold ball bonder. Similar in positioning to the 4124 model you previously inquired about, it belongs to a newer K&S platform and is frequently used for process development, R&D, and small-batch production.

Core Process and Specifications

The system utilizes a thermosonic ball bonding process. It forms a ball at the end of the gold wire via a Negative Electronic Flame-Off (N.E.F.O.) system and completes the bond using a 60 kHz ultrasonic transducer. It supports gold wire diameters ranging from approximately 18 to 76 µm, offers a bonding area of 152 mm × 152 mm (6 inches × 6 inches), provides a bonding force of 10 to 160 grams, and features a heated work stage capable of reaching temperatures up to approximately 250°C.

Functionality and Positioning

In addition to standard ball bonding, the 4522 supports "ball bumping"—a process suitable for flip-chip applications or specialized interconnect R&D. It offers both semi-automatic and manual operating modes and is equipped with a heated work stage, making it well-suited for university laboratories, research institutions, and small-scale production lines.

Summary

As a classic manual gold ball bonder designed for process development and low-volume production, the 4522 remains in use within microelectronics packaging R&D environments, thanks to its proven ball bonding/bumping capabilities and flexible operation. Most 4522 units currently available on the market are pre-owned (second-hand).