Used Hesse Bondjet wire bonder BJ855 for sale

The HESSE Bondjet BJ855 is a fully automatic, high-speed fine-wire bonder manufactured by the German company Hesse Mechatronics. It supports both wedge-wedge and ball-wedge bonding head configurations.

Core Capabilities

The system can process a variety of wire materials—including aluminum, gold, silver, copper, and platinum—with diameters ranging from 12.5 µm to 75 µm; it also supports aluminum and gold ribbon. It features a working area of 305 mm × 410 mm, a Z-axis travel of 31 mm, and a P-axis rotation of 440°. In terms of speed, when configured with a wedge-bonding head, it can achieve a throughput of 7 wires per second (based on a 25 µm wire diameter and a 1 mm wire loop).

Process Features

A key feature of the BJ855 is its deep-access bonding capability; its 90° wedge-bonding head is specifically designed for deep-cavity packaging, reaching depths of up to 1.9 mm. The equipment is equipped with zero-latency touchdown detection, making it well-suited for operations on extremely thin substrates. Its image recognition system utilizes digital image processing enhanced by flash illumination. Additionally, the system offers an optional PiQC (Process Integrated Quality Control) module, enabling 100% real-time quality monitoring.

Applications

Typical applications for this system include component packaging in fields such as high-frequency/RF technology, COB (Chip-on-Board), MCM (Multi-Chip Modules), hybrid circuits, optoelectronics, and automotive electronics.