YAMAHA Shinkawa UTC-5000NeoCu Super

The YAMAHA (Shinkawa) UTC-5000NeoCu Super is a high-speed, fully automatic wire bonder designed for copper, palladium-coated copper (PCC), and silver wires. As an upgraded model within the UTC-5000 series, it excels in versatility across various wire types.

Core Positioning

Rather than being limited to gold wire, this model is optimized for copper wire and alternative materials. It supports pure copper, palladium-coated copper (PCC), and silver wires with diameters ranging from φ15 to 50 μm. The EFU (Electronic Flame-off Unit) power supply allows for wire diameter changes without the need to replace hardware components.

Key Performance

The system offers a bonding accuracy of ±2.0 μm (3σ) and a bonding speed of 45 ms for a 2 mm wire length, with both the XY table and Z-axis featuring a resolution of 0.1 μm. It incorporates Shinkawa’s proprietary NRS (Non-Reaction-Force Servo) system for vibration control, and is equipped with a bonding head capable of applying up to 1,000 gf of force, paired with a high-rigidity transducer—ideal for high-quality bonding in QFN packages and applications involving thicker copper wires.

Process and Efficiency Features

The machine comes standard with "SimLoop" wire-loop optimization. Through automatic optimization and an "Over Drive" mode, it can increase throughput (UPH) by approximately 7%. It also integrates "Neo-Spark" (for stable initial ball formation), "Neo-Cut" (for fine-pitch bump formation), and "Neo-Step" (for bonding process optimization). Digital control of inert gas flow rates helps reduce setup time during product changeovers.

Quality Assurance

The system features BIM (Bonded-ball Position Inspection), which calculates and corrects offsets in real-time based on post-bonding imagery. Additionally, FAM (Free-air-ball Automatic Monitoring) tracks the diameter and shape of the initial ball, ensuring the high-reliability bonding characteristic of the UTC-5000 series.

Released in 2018, this model is primarily designed for semiconductor packaging lines that utilize copper or silver wire processes, making it well-suited for QFN/DFN packaging and production environments that require the handling of multiple wire types.