ThinkLaser SC300 for sale

The ThinkLaser SC300 is a fully automated laser "soft marking" system for semiconductor wafers. Designed specifically for 300mm wafers, its primary purpose is to create permanent, traceable marks without damaging the wafer surface.

Key Difference from the HM300

While the HM300—which you previously inquired about—performs "hard marking," the SC300 utilizes "soft marking":

SC300 (Soft Marking): Employs patented SuperSoftMark® technology, which alters only the surface reflectivity of the material. The resulting marks are extremely shallow (approximately 2.5 microns) and free of debris or physical damage, making this system ideal for advanced manufacturing processes or compound semiconductors that demand exceptionally high levels of cleanliness.

HM300 (Hard Marking): Designed for significant depth (up to 110 microns), ensuring that marks remain intact even after intensive downstream processes like grinding or cleaning.

Core Specifications

Wafer Size: Standard 300mm (compatible with 200mm).

Throughput: Up to approximately 125 wafers per hour (WPH).

Positioning Accuracy: ±0.125mm within a 50×50mm area.

In short, the SC300 is the preferred traceability solution when it is critical to ensure that the wafer surface remains completely undamaged and free from particulate contamination.