Used Nitto DR3000III

The Nitto DR3000III, part of the Nitto Denko "NEL SYSTEM" series, is a fully automated wafer protective tape application system designed specifically for the semiconductor back-grinding process. Its primary function is to precisely apply protective tape to the circuit side of a wafer before the thinning process, thereby preventing mechanical damage or contamination of the delicate circuit patterns during grinding.

Core Process: Low-Stress Application

The system’s most notable technical feature is its ability to apply tape with minimal tension and controlled stress. By precisely regulating tape tension, the DR3000III minimizes stress on the wafer surface during application—a critical capability when handling thin or warped wafers, as it effectively reduces the risk of wafer breakage during subsequent grinding operations.

Throughput and Compatibility

The system supports both 300mm and 200mm wafers with a thickness of 400μm or greater, achieving a standard throughput of 68 wafers per hour. In terms of automation and factory integration, it is compatible with both FOUPs and open wafer cassettes. It comes standard with log-file generation and tape-sag detection, with optional features such as a wafer-mapping scanner and support for the SECS/GEM communication protocol to meet the data traceability and automated management requirements of high-volume production lines. The equipment complies with CE marking and SEMI S2/S8 safety standards.

Summary

The DR3000III is a mature, production-proven system used for protective tape application prior to back-grinding. With its stable, low-stress application capabilities and high processing throughput, it serves wafer-thinning production lines for logic chips, memory devices, and power semiconductors.