KAIJO WBB-2000 Wedge Bonder for sale

The KAIJO WBB-2000 is a semi-automatic wedge bonder designed for small-batch, high-mix, and complex R&D applications. Unlike fully automated production equipment—which prioritizes maximum throughput—the WBB-2000’s core value lies in its exceptional process flexibility and the ability for manual operator intervention.

Core Positioning and Architecture

Operating in a semi-automatic mode, this model is ideally suited for university laboratories, research institutes, and advanced packaging R&D departments within corporate environments. It handles not only standard gold and aluminum wires but also supports ribbon bonding and heavy-gauge wire bonding. With a broad range of compatible wire diameters, it is well-equipped for interconnecting specialized components, such as microwave/RF devices, optoelectronics, and power modules.

Key Process Features

The WBB-2000 is equipped with a precision XYZ motion stage and a high-magnification stereo microscope, enabling operators to perform accurate visual alignment. It features a closed-loop ultrasonic transducer system, where bonding force, power, and duration can be independently and precisely adjusted—ensuring that delicate substrates or components with deep-cavity structures remain undamaged during the bonding process. Furthermore, the system allows for the storage of multiple sets of process parameters, facilitating rapid switching between different R&D samples.

Typical Applications

Typical use cases for the WBB-2000 include prototyping high-frequency microwave circuits, interconnecting MEMS sensors, and small-batch, customized power device packaging. While not designed for high-volume mass production, it serves as an effective, desktop-class process validation tool for cutting-edge engineering projects that require frequent adjustments to wire-loop profiles or the testing of novel material combinations.