Used K&S ConnX Plus for sale

The K&S ConnX Plus is a second-generation high-speed ball bonder introduced by Kulicke & Soffa in 2012. Part of the "Power Series" product line, it is primarily designed for the market segment involving low-pin-count devices, discrete components, and cost-sensitive packaging, aiming to maximize throughput while maintaining high reliability.

Core Upgrades and Key Features

Compared to the first-generation ConnX, the ConnX Plus offers an increase in UPH (units per hour) of approximately 10%. New features include "Look Ahead Vision"—an interactive, programmable vision system that simplifies initial setup—and the "Power Series Xpress Loop," which enhances throughput for short-wire applications. It also offers an optional "Dual Mag Optics Kit" to support stacked-die bonding for discrete components and low-pin-count devices. Furthermore, the system can be upgraded in the field to the "ConnX Plus LAPS" version, extending the bonding area to 87mm to accommodate larger package sizes.

Summary of Positioning

The ConnX Plus is a second-generation high-speed ball bonder tailored for cost-sensitive, high-volume production environments. Its primary value lies in delivering superior net throughput for low-pin-count packages, combined with flexible support for stacked-die applications. The system was first unveiled to the public at the 2012 Semicon China exhibition.