Used K&S Maxum Ultra Fully Automatic Gold Ball Bonder

The K&S Maxum Ultra is a high-performance, fully automatic gold-wire ball bonder from Kulicke & Soffa (K&S). In 2006, it received the "Editors' Choice Best Product Award" from *Semiconductor International* magazine. It was designed as a high-throughput solution for complex packaging applications.

Core Performance

The most notable feature of this model is a 10% increase in throughput compared to its predecessor, the Maxum Plus, achieving a bonding cycle time of 60 milliseconds (based on a standard wire loop and a 2.5mm wire length). In terms of precision, it offers a bond placement accuracy of ±2.5 μm @ 3σ and supports processes requiring pad pitches as fine as 35 μm. At the time of its release, these specifications gave it a distinct advantage in both efficiency and precision over similar products.

Key Technologies

The Maxum Ultra incorporates several hardware upgrades: a new bonding force control system utilizing piezoelectric sensors, which increases the motion speed of the bonding head without raising the impact force of the tool; and an enhanced wire-feed/tensioning system that reduces friction along the wire path, ensuring consistent wire loops even at high speeds. The system supports copper wire bonding and includes a feature for detecting small bond balls.

Applications

The system is officially positioned for complex packaging applications, including stacked-die configurations, multi-level packaging, devices using low-k dielectric materials, and applications involving ultra-fine pitches or long, low-profile wire loops. Data from the secondary market indicates that this model remains in circulation within production lines for discrete devices and integrated circuits. When evaluating a used unit, it is advisable to focus on the actual wear condition of the bonding head and the software version, rather than relying solely on the model number to determine its suitability for a specific process.