Used KAIJO FB-i28 for sale

The KAIJO FB-i28 is a high-speed, fully automatic ball bonder designed for high-end, fine-pitch packaging. It is engineered to deliver exceptional positioning accuracy and precise wire-loop control, meeting the demanding interconnect requirements of high-density chips.

Core Performance and Specifications

The system excels in mechanical motion control, offering superior repeatability that ensures stable processing of ultra-small bond pads. Equipped with a high-rigidity bonding head and high-speed linear motors, the FB-i28 minimizes the bonding cycle time per wire, achieving high throughput (UPH) while maintaining micron-level precision. It supports a wide range of wire diameters and is compatible with various materials, including gold, copper, and palladium-coated copper wires.

Key Process Features

The FB-i28 incorporates an advanced digital closed-loop control system that enables real-time, fine-tuned adjustments to ultrasonic power and bonding force, significantly improving yields when working with complex substrates or sensitive chips. In terms of process capabilities, it supports low-loop, reverse-loop, and multi-segment loop control—essential features for preventing wire shorts in high-density BGA, CSP, and stacked-die (PoP/SiP) packages. Furthermore, the optimized vision system delivers enhanced speed and accuracy in pattern recognition (PRS).

Applications

This model is primarily utilized in semiconductor packaging production lines that demand the highest levels of precision and reliability, such as those for high-end communication chips, microprocessors (MCU/SoC), and automotive electronic chips. Compared to entry-level models, the FB-i28 offers a distinct advantage in managing complex wire-loop profiles and maintaining exceptionally high production yields.