Used Yamaha UTC-RZ1 wire bonder

The Yamaha (developed by its subsidiary, Shinkawa) UTC-RZ1 is a new-generation, fully automatic wire bonder that combines high throughput with a compact footprint. It is designed primarily to enhance productivity per unit of floor space while meeting the stringent high-reliability requirements of sectors such as automotive semiconductors.

Key Performance Enhancements

Compared to its predecessor, the UTC-5000NeoCu Super, the UTC-RZ1 features a 25% smaller footprint, a 14% increase in UPH (units per hour), and a 37% improvement in overall area productivity. It offers a bonding accuracy of ±2.0 μm (@ 3σ), a bonding speed of 40 ms per wire (at a 2mm wire length), and an XYZ-axis resolution of 0.1 μm.

Core Technologies and Specifications

The system incorporates the newly developed UCAC2 (Ultrasonic Compensation and Control) function, which measures Z-axis behavior during ball bonding and automatically adjusts ultrasonic power to minimize performance variations between machines. It supports gold, copper, silver, and PCC (palladium-coated copper) wires with diameters ranging from 15 to 65 μm, and allows for switching between 123 kHz and 60 kHz ultrasonic frequencies via the user interface. Furthermore, it reduces high-pressure air consumption by 50% and peak power consumption by 12%, helping to lower operational costs.

Automation and Applications

The machine offers optional features such as automatic capillary (bonding tool) replacement and automatic error recovery. It also supports interfaces for automated magazine handling, facilitating integration into fully automated production lines. It is primarily targeted at the packaging of consumer electronics and automotive semiconductors, making it particularly well-suited for automotive chip production lines that demand rigorous quality control.