YAMAHA Shinkawa UTC-5100 for sale

The YAMAHA (Shinkawa) UTC-5100 is a high-speed gold-wire bonder designed for the production of LEDs and discrete semiconductor devices. It is engineered to strike an optimal balance between high throughput and consistent precision when processing wide-format lead frames.

Core Performance

Featuring fully upgraded X, Y, and Z-axis motors, this model achieves a bonding speed of 42 ms/0.7 mm (or 45 ms for a 2 mm wire length). It delivers a bonding accuracy of ±3.0 μm (3σ), with a control resolution of 0.1 μm for both the XY table and the Z-axis. To ensure stability during high-speed motion, the system incorporates Shinkawa’s proprietary NRS (Non-Reaction Servo) technology.

Wide-Format Lead Frames and Process Capabilities

The equipment offers a 95 mm bonding area along the Y-axis and can handle lead frames measuring 102 mm × 300 mm—dimensions commonly found in LED and discrete device production lines. It supports gold wire diameters ranging from φ18 to 50 μm, with a bonding force capacity of 3–1,000 gf, and can execute up to 12,000 bonds per program. An optional copper-wire kit is also available to enable copper-wire bonding.

Quality Assurance Features

The system is equipped with BIM (Bonded-ball Position Detection), which calculates positional offsets based on post-bonding imagery and applies real-time corrections. It also features FAM (Free-air-ball Automatic Monitoring), which tracks the diameter and shape of the initial ball to ensure consistent ball-forming quality. Furthermore, the series supports CWB (Capillary Wedge Bonding) technology, allowing for continuous bonding across multiple stacked layers without cutting the wire—a capability that enhances efficiency in multi-die packaging applications, such as NAND flash memory.

Target Applications

This bonder is primarily designed for LED packaging and discrete semiconductor device production lines, making it particularly well-suited for high-volume manufacturing environments that require both high-speed output and stable precision on wide-format lead frames.