Used SINTAIKE STK-7080

The SINTAIKE STK-7080 is a fully automated wafer taping machine designed for applying protective tape to wafers (8 inches/200mm or smaller) prior to thinning and dicing processes.

Core Positioning: High-Throughput, Fully Automated Platform

Unlike semi-automated models such as the 7020, the STK-7080 features fully automated wafer loading/unloading and taping operations (typically equipped with standard wafer cassette or FOUP interfaces). It integrates seamlessly into automated mass-production lines, significantly reducing the need for manual intervention while enhancing batch consistency and Overall Equipment Effectiveness (OEE)—making it an ideal solution for high-volume production environments.

Key Technical Features

Automated Handling and Taping: An integrated robotic arm handles wafer loading and unloading, while an anti-static roller-based taping system and an automatic tape-cutting mechanism ensure high-speed, highly stable continuous operation, effectively preventing human-induced scratches or contamination.

Precision Temperature and Tension Control: Equipped with heating modules for the stage and cutting blade, combined with precise tape tension control, the system ensures that the tape adheres smoothly and evenly to the wafer surface, drastically reducing the incidence of air bubbles and the risk of edge delamination.

Comprehensive ESD Protection and Versatility: The system incorporates a multi-layered anti-static framework (utilizing ESD-safe stages, rollers, and ionizers). It is compatible with various tape types—such as blue tape and UV-curable tape—and supports the processing of diverse wafer materials, including Si, SiC, and GaN.

Summary: With its full automation, high throughput, and consistent taping quality, the STK-7080 serves as a core piece of equipment for enhancing efficiency in the pre-thinning and pre-dicing stages of small-to-medium-sized wafer mass production.