Used TEL Track System CT™8Z

The TEL CLEAN TRACK™ CT8Z is a fully automated track system designed for 200mm (8-inch) and smaller wafers. As part of TEL’s classic CLEAN TRACK series, it serves as a primary lithography-support platform for 8-inch mature-node and specialty-process production lines.

Core Positioning: A Reliable Hub for High-Volume Production at Mature Nodes

This system handles all chemical and thermal processing steps for wafers before and after lithography (exposure in a stepper/scanner), including photoresist spin-coating, soft-baking, post-exposure baking (PEB), developing, and hard-baking. It is widely used in the production of power semiconductors, analog chips, MEMS, and RF devices, and is recognized for its high process stability and exceptionally low defect rate.

Key Technical Features

Highly Integrated Cluster Architecture: The system integrates coating, thermal (hot plate), cooling, and developing units, with a high-speed central robotic handler managing wafer transport. Its modular design allows for flexible configuration based on capacity requirements, ensuring high throughput and high equipment utilization.

Precise Temperature Control and Fluid Management: Multi-zone independent temperature-controlled hot plates ensure baking uniformity, minimizing pattern distortion. Precise control over spin-coating rotational speeds and developer flow rates guarantees uniformity in photoresist thickness and consistency in critical dimensions (CD) across batches.

High Cleanliness and Seamless Integration: A built-in "mini-environment" with airflow control prevents particle contamination. The system supports standard wafer-carrier (FOUP/cassette) loading and unloading, as well as SECS/GEM communication, allowing for seamless integration with various 8-inch lithography tools and automated production lines.

Summary

With its mature and stable coating/developing processes, flexible modular configuration, and excellent automation integration capabilities, the TEL CT8Z stands as a core piece of equipment for ensuring lithography yields and high-volume production efficiency in 200mm mature-node and specialty-process manufacturing.