Used ACCRETECH CMP System ChaMP

The ACCRETECH ChaMP is a fully automated Chemical Mechanical Polishing (CMP) system designed for wafers 200mm (8 inches) in diameter and smaller. Developed by Tokyo Seimitsu (Accretech), it is widely used in mature-node manufacturing, specialty process technologies, and the compound semiconductor sector.

Core Positioning: A Cost-Effective, Standalone High-Volume Production Platform

Built on a "compact yet efficient" design philosophy, the system integrates polishing, cleaning, and endpoint detection. It is particularly well-suited for cost-sensitive production lines that demand high process stability—such as those manufacturing power semiconductors, MEMS, and silicon-based optoelectronic devices.

Key Technical Features

High-Rigidity Polishing Head with Precision Pressure Control: The polishing head features independent zonal pressure control, which effectively mitigates the "dishing" effect at wafer edges and improves within-wafer thickness uniformity (TTV), meeting stringent requirements for precise film-thickness control.

Integrated Cleaning and Drying: The system incorporates high-efficiency brush-cleaning and spin-drying modules. By performing cleaning immediately after the polishing process, it prevents slurry residue and particle re-adhesion, ensuring superior surface cleanliness.

Proven Endpoint Detection System: Equipped with optical or eddy-current-based film-thickness monitoring, the system enables precise termination of the polishing process, minimizing yield loss caused by over-polishing or under-polishing.

Summary

With its compact footprint, highly stable zonal pressure control, and comprehensive integrated cleaning capabilities, the Accretech ChaMP serves as an ideal CMP production solution for 200mm (and smaller) wafer lines, offering an optimal balance between process precision and total cost of ownership.