Used SINTAIKE STK-7150

The SINTAIKE STK-7150 is an advanced, fully automated wafer mounter designed for 12-inch (300mm) wafers. Building upon the foundation of the STK-7120, it features process enhancements tailored to the rigorous demands of advanced packaging, with a primary focus on high-precision tension control and compatibility with complex film materials.

Core Positioning: A Platform Dedicated to Advanced Packaging

This model supports 300mm wafers (with 200mm compatibility) and integrates a fully automated robotic handling system with FOUP (Front Opening Unified Pod) loading and unloading. Its key advantage lies in its ability to handle the thinner wafers and more complex film materials used in advanced packaging (such as Fan-Out and 2.5D/3D technologies), delivering higher mounting yields.

Key Technical Features

Precision Closed-Loop Tension and Temperature Control: Equipped with a high-precision closed-loop tape tension control system and multi-zone temperature control (including heated stages and cutting tools), the machine ensures a wrinkle-free, bubble-free mounting process—even for ultra-thin or warped wafers—while providing superior edge adhesion.

Advanced Film Compatibility: Beyond standard UV-curable and blue tapes, the mounting mechanism has been optimized for specialized materials such as DAF (Die Attach Film). This minimizes stress and bubble formation during the mounting process, ensuring reliability for subsequent dicing and die-bonding operations.

Comprehensive ESD Protection and Cleanroom Design: The system incorporates a multi-layered anti-static framework (utilizing ionizers, anti-static rollers, etc.) combined with an optimized airflow design within the chamber, meeting the stringent particle contamination standards required for advanced packaging.

Summary

With its enhanced precision for large-format wafer mounting and its capability to process complex film materials, the STK-7150 serves as a critical piece of equipment for ensuring high yields during the front-end processes of 300mm advanced packaging production lines.