ASM AD830P-Plus

The ASM Die Bonder AD830P-Plus is a high-speed, fully automated die bonder for LED packaging applications. Based on the AD830 Plus platform, it enhances specific process capabilities. Key features include re-die LED handling capabilities, a top-view lens for identifying the bottom PN electrode of the wafer, and an optional re-die arm module.

In terms of inspection and efficiency, this model features a new image recognition system that supports simultaneous identification and inspection during dispensing and die bonding. It also features a "PR On The Fly" top-view recognition function, improving positional accuracy without sacrificing die bonding cycle time. An optional bottom-view lens enables double-sided image inspection of the wafer. The equipment supports fully automated material handling and offers optional fully automated wafer loading/unloading systems and interconnectivity. The machine dimensions are 1,740 × 1,240 × 2,080 mm³.