BESI Datacon 2200 evo advanced

The BESI Datacon 2200 evo advanced is the highest-precision model within Besi’s Multi-Module Attach platform, designed as a high-precision, multi-chip die bonder for mass production. While retaining the signature flexibility and open architecture of the 2200 evo series, it elevates placement accuracy to the top of the product line through an all-new gantry system, an advanced controller, and a next-generation vision system.

In terms of core specifications, it achieves an X/Y placement accuracy of ±3 μm (@ 3σ) and a rotational accuracy of ±0.07° (@ 3σ)—a significant improvement over the ±10 μm accuracy of the base 2200 evo model and the ±7 μm of the 2200 evo plus. Regarding throughput, it reaches up to 7,000 UPH per module for epoxy bonding, while flip-chip processes achieve approximately 2,500 UPH with flux/adhesive dipping, or 3,200 UPH without dipping.

Flexibility remains a hallmark of this machine: a single pass can utilize up to 14 pick-and-place tools and 5 ejector tools, with support for the simultaneous use of three different types of adhesives. The system accommodates a wide range of processes—including epoxy bonding, soldering, thermocompression, and eutectic bonding—and handles input media such as wafers, waffle packs, Gel-Paks, and various feeders, with a substrate working area of 325 mm × 200 mm. For mass-production environments that require both high precision and the integration of multiple processes on a single platform, the evo advanced stands out as the highest-precision option within the 2200 series.