BESI Datacon 8800 FC QUANTUM advX

What kind of machine is it?

It is an "advanced precision" model within the Datacon 8800 FC QUANTUM series. Positioned as a high-speed, high-precision flip-chip bonder designed for large-scale mass production, it is primarily used for chip-to-substrate (C2S) applications involving mass reflow soldering.

Core Features

Precision and Speed: Offers a placement accuracy of ±4 μm @ 3σ (with an option for ±3 μm) and a maximum throughput of approximately 10,000 UPH (depending on the specific application).

Supported Dies: Accommodates die sizes ranging from 0.3 mm to 40 mm; compatible with applications such as FC-BGA, FC-CSP, DRAM, and Fan-out C2W.

Key Technologies: Features a dual-gantry system, an extra-large CRYSTAL dipping module, and Besi’s latest vision system—all engineered to balance high-speed operation with precise placement and yield control.

Within the 8800 FC QUANTUM family, this model is positioned differently from the "hS" version you previously asked about (which focuses on an extreme throughput of 16,000 UPH). The "advX" variant places greater emphasis on offering broader compatibility with various die sizes and more flexible precision options, while still maintaining a high level of throughput.