BESI Datacon 8800 FC QUANTUM hS

The BESI Datacon 8800 FC QUANTUM hS is a high-speed flip-chip die bonder designed for high-volume production, with a core focus on minimizing the cost per unit without compromising precision. Built on the Datacon QUANTUM platform, it delivers a significant boost in speed compared to its predecessor, the FC QUANTUM advanced.

Its standout feature is the unique "Quattro" multi-nozzle concept, which, combined with synchronized process steps, enables a throughput of up to 16,000 UPH (depending on the application) while maintaining a placement accuracy of ±4 μm @ 3σ—ensuring consistent, high-yield performance across multiple units. The vision system incorporates high-resolution, large-field-of-view cameras (16×16 mm for the substrate; 29×29 mm for the wafer and upward-looking cameras) and supports cluster alignment.

For process control, the machine offers "pseudo" X-ray enhanced inspection, rapid post-bonding inspection, independent verification of pick/flip/place tools, and die-crack detection, ensuring comprehensive yield management throughout the entire process. It accommodates die sizes ranging from 1 to 14 mm with thicknesses between 70 μm and 2 mm, and supports various substrate formats, including 8–12 inch wafers, lead frames, and strips.