BESI Datacon 2200 evo hS

The BESI Datacon 2200 evo hS is a high-speed variant within the 2200 evo family, specifically engineered for multi-module die bonding. While maintaining the platform’s signature openness and process compatibility, it pushes the series' throughput capabilities to the highest level.

The most significant advancement is a major leap in efficiency: by incorporating a new high-speed image processing unit, the system achieves a throughput of up to 12,000 UPH (units per hour)—the highest in the 2200 evo series—all while upholding a placement accuracy of ±7 μm @ 3σ. Precision stability is further enhanced by a new camera system combined with thermal compensation algorithms, ensuring consistent alignment accuracy during long-term operation.

In terms of process capabilities, the hS continues the platform’s tradition of integrating multiple processes into a single machine. It supports a wide range of thermal and non-thermal assembly methods—including epoxy bonding, soldering, thermocompression, and eutectic bonding—and accommodates various input formats such as wafers, waffle packs, Gel-Paks, and feeders. Flexibility remains a core feature: the system can be configured with up to 7 pick-and-place tools (expandable to 14) and 5 ejector tools. Coupled with diverse dispensing options—such as pressure/time, rotary, and jet dispensing—the platform is well-suited for handling adhesives of varying viscosities and complex multi-chip assembly requirements. For production lines that demand maximum throughput without compromising the ability to handle diverse, multi-module processes, the hS offers an ideal solution that balances speed and flexibility, with a distinct emphasis on high-efficiency performance.