Besi Datacon 8800 CHAMEO advanced

The Datacon 8800 CHAMEO advanced is a high-precision, automated die bonder from the Datacon product line—part of the Dutch semiconductor equipment giant BE Semiconductor Industries (Besi). Primarily targeting the Fan-Out Wafer-Level Packaging (FO-WLP) market, it is recognized as one of the most productive systems available for this process.

Built upon the proven Datacon platform, the system is specifically designed for die placement in Wafer-Level Fan-Out Packaging (WL-FOP). It supports both face-up and flip-chip (flip mode) placement, offering the flexibility to accommodate a wide range of packaging designs. Its core strength lies in balancing high precision with high throughput: it achieves a local placement accuracy of ±3µm (3σ) on the X/Y axes—with an optional ±2µm configuration—and a global accuracy of ±5µm (3σ). The placement force ranges from 2N to 50N, with an optional low-force configuration (0.5–10N) available for handling thin dies or sensitive components.

Leveraging an advanced vision alignment system and precise motion control, the 8800 CHAMEO advanced excels in applications such as multi-die bonding and high-density interconnect packaging. It serves as a critical piece of equipment in production lines for high-performance chips, including those used in smartphones and AI processors.