BESI Datacon 2200 evo plus

The BESI Datacon 2200 evo plus is a highly flexible die bonder designed for multi-module attach applications. Built on a mature platform, it enables seamless switching between die attach, flip-chip, and multi-chip processes, balancing high precision with cost-effectiveness.

The system offers a placement accuracy of ±7 μm @ 3σ and an angular accuracy of ±0.10°, with a programmable bonding force ranging from 0.5 N to 75 N. Throughput varies by process: up to 7,000 UPH for epoxy-based die attach, approximately 2,500 UPH for flip-chip with flux/adhesive dipping, and approximately 3,200 UPH for flip-chip without dipping. It accommodates a wide range of die sizes—from 0.15 mm to 30 mm for die attach and 0.5 mm to 30 mm for flip-chip—and supports wafers from 4 to 12 inches, with a substrate working area of 325 mm × 200 mm.

A key strength of the system is its versatility: it can handle various input formats—such as wafers, waffle packs, and Gel-Pak trays—and supports diverse substrates, including PCBs and lead frames. It is compatible with a wide array of bonding processes, including epoxy, soldering, thermocompression, and eutectic bonding. Equipped with an automated wafer and tool-change system, the machine supports up to 7 pick-and-place tools (expandable to 14), making it well-suited for high-mix, multi-product production environments.