BESI Esec 2100 sD advanced i

The BESI Esec 2100 sD advanced i is a high-precision die bonder from the Esec 2100 series.

Positioned as a high-precision epoxy die bonder, its key features include:

Precision Options: Depending on the configuration, placement accuracy can reach 8 μm, 10 μm, or 15 μm.

Key Components: It is equipped with a new component height sensor, a high-precision bond head, a high-resolution upward-looking vision system, and a dual-dispensing module—all designed to enhance process capabilities and boost productivity in high-speed applications.

Automation Features: The system supports automatic optimization of tool offsets and dispensing pressure following a syringe change, thereby minimizing the need for manual intervention.