Used ASM AD838L-G2 for sale

The AD838L-G2 is a die bonder from ASMPT. Part of the AD series, it is designed for high-volume die-bonding applications within advanced packaging production lines. As a die bonder, its primary function is the high-precision placement of bare dies onto substrates or wafers; it is not used for testing or thin-film deposition.

Process Application: The system is utilized for flip-chip bonding, die stacking in 2.5D/3D packaging, and die placement for fan-out packaging. It addresses the critical requirements for high-precision alignment and stable bonding between the die and the substrate, falling under the category of back-end packaging processes. The "G2" suffix indicates that this is a second-generation or upgraded platform; compared to the base AD838L model, it features enhancements in motion control, visual alignment, and throughput.

Design Focus: The system emphasizes high-precision visual alignment and bonding stability. It is equipped with sophisticated motion control and vision systems, supports flexible switching between various packaging recipes, and balances high-volume throughput with high bonding yields. As a second-generation platform, it typically offers optimizations in cycle time, equipment utilization, and changeover efficiency, making it well-suited for high-volume packaging scenarios that demand both high placement precision and overall operational efficiency.

Classification: Within the spectrum of packaging equipment, this system belongs to the die-bonding category—a distinct process segment separate from thin-film deposition or electroplating. Along with ASMPT’s PHOTON and MEGA series, as well as Canon’s BESTEM series, it addresses the precision requirements for die placement in advanced packaging. In short, the AD838L-G2 is one of ASMPT’s high-volume production models for advanced packaging die bonding; specific configurations should be verified against official product specifications.