Mi Equipment Mi18 Wafer-to-Waffle-Pack die sorter

The Mi18, developed by Mi Equipment (Malaysia), is a wafer-to-waffle-pack sorter designed for high-parallelism sorting and comprehensive visual inspection. It is tailored for the mass production of high-performance computing (HPC) and memory chips.

Key Features

Multi-Bin Sorting: Supports output sorting into up to 38 bins, making it ideal for production environments that require simultaneous classification into multiple grades or categories—ensuring that every bin serves a specific purpose.

Six-Sided AOI: Features integrated six-sided Automated Optical Inspection (AOI), allowing for the visual quality assessment of all six surfaces of a chip during the sorting process, eliminating the need for separate, offline inspection steps.

Output Format: Configured by default for output into waffle packs, facilitating subsequent packaging or transport processes.

Summary

The primary value proposition of the Mi18 lies in its integration of high-density, multi-bin sorting with six-sided AOI on a single platform. It is well-suited for high-volume chip production—particularly in the HPC and memory sectors—where high sorting throughput and stringent control over visual yield are essential.