Canon FPA-3030EX6 for sale

The Canon FPA-3030EX6 is a KrF stepper lithography system released in 2016, designed for the manufacturing of IoT devices, sensors, and power components. It is primarily positioned to deliver cost-effective, high-resolution exposure on substrates of 200mm or smaller.

The system utilizes a KrF excimer laser (248nm) and offers a resolution of ≤150nm, an overlay accuracy of ≤25nm, an automatically adjustable numerical aperture (NA) ranging from 0.50 to 0.65, and an exposure field of 22×22mm. In terms of throughput, it can process over 121 wafers per hour (based on 200mm wafers with 60 shots). A key feature is its versatility with various specialized substrates; it supports multiple sizes—100, 125, 150, and 200mm—and offers optional handling capabilities for warped wafers, bonded wafers, and transparent substrates. It shares the same wafer transport system as the i-line model, the FPA-3030i5+. Furthermore, the system is compatible with the reticles and process recipes used for its predecessor, the FPA-3000EX6, allowing customers to maximize the value of their existing assets. In short, rather than targeting advanced process nodes, the FPA-3030EX6 serves as a long-lifecycle KrF stepper solution tailored for the diverse, small-batch substrate requirements found in mature manufacturing processes.