Used Canon FPA-3030iWa Stepper Lithography System

The Canon FPA-3030iWa is a low-numerical-aperture (Low-NA) i-line stepper, announced in 2019 and released in 2020. Designed specifically for substrates 200mm or smaller, its core value lies in its exceptionally large depth of focus (DOF), which addresses the unique challenges posed by compound semiconductors and complex surface topographies.

Unlike other models in the same series that prioritize high resolution, the iWa features an NA of only 0.16–0.24, a resolution of ≤0.8μm, and an overlay accuracy of ≤100nm. Its primary advantage is a massive 52mm × 52mm exposure field combined with a large DOF—making it ideal for processes involving thick photoresists or device layers with significant surface topography, rather than applications requiring ultra-fine line widths.

Wafer compatibility is another key selling point: the system supports five substrate sizes ranging from 50mm to 200mm. It offers an optional specialized substrate handling system capable of processing transparent substrates (such as silicon carbide) and warped wafers. An off-axis alignment scope expands the range of available alignment wavelengths, enhancing adaptability to a diverse array of materials and processes. Essentially, this model serves as a modernized replacement for Canon’s legacy FPA-3000iW platform (introduced in 1995), specifically targeting applications—such as power devices, MEMS, and 5G communication components—where, while strict line-width resolution may not be required, the specific surface topography and material properties demand highly specialized exposure capabilities.